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EUTM file information

016062788

ECO SOLDER SMIC


November 18, 2016

Trademark Summary

The trademark application ECO SOLDER SMIC was filed by SENJU METAL INDUSTRY CO., LTD., a corporation established under the laws of Japan (the "Applicant"). The application was published for oppositions on February 22, 2017, and it was registered by office on June 1, 2017 without any oppositions.

The application was filed in Dutch (English was selected as the second language).


Goods And Services

  • The mark was filed in class 1 with following description of goods:
    1. Solder cream
    2. Soldering chemicals
    3. Fluxes (soldering -), soldering fluxes.
  • The mark was filed in class 6 with following description of goods:
    1. Solders, solder paste, solder wire, resin core wire, solder preform, solder ball, ingot solder, lead-free solder
    2. Solder alloys
    3. Silver solder, solder (silver -)
    4. Solder (gold -)
    5. Soldering wire of metal.