EUTM file information

019078541

Μ -Material Machine

September 11, 2024

Trademark Summary

The trademark application μ -Material Machine was filed by Shin-Etsu Chemical Co., Ltd., a corporation established under the laws of Japan (the "Applicant"). Application under examination.

The application was filed in English (Italian was selected as the second language).

Goods And Services

  • The mark was filed in class 7 with following description of goods:
    1. Automatic electronic component mounting machines, namely, machines for automatically mounting IC chips or other electronic components to printed wired boards, and parts and accessories thereof
    2. Machines for mounting IC chips to circuit boards, and parts and accessories thereof
    3. LED wafer processing equipment, and parts and accessories thereof
    4. LED wafer treatment equipment, and parts and accessories thereof
    5. LED chip transferring machines, and parts and accessories thereof
    6. Machines for automatically mounting LED chips to printed wired boards, and parts and accessories thereof
    7. Machines for mounting LED chips to circuit boards, and parts and accessories thereof
    8. Stamps and plates for use in manufacturing LED chips
    9. LED chip manufacturing machines, and parts and accessories thereof
    10. LED manufacturing machines, and parts and accessories thereof
    11. Wafer processing machines, and parts and accessories thereof
    12. Wafer treatment machines, and parts and accessories thereof
    13. Laser processing machines and apparatus for glass processing, and parts and accessories thereof
    14. Glass processing machines and apparatus, and parts and accessories thereof
    15. Glassware manufacturing machines and apparatus
    16. Laser processing machines and apparatus for ceramic, and parts and accessories thereof
    17. Ceramic processing machines and apparatus, and parts and accessories thereof
    18. Chip transferring machines, and parts and accessories thereof
    19. Automatic electronic component mounting machines, namely, machines for automatically mounting chips to printed wired boards, and parts and accessories thereof
    20. Machines for mounting chips to circuit boards, and parts and accessories thereof
    21. Stamps and plates for use in manufacturing chips
    22. Chip manufacturing machines, and parts and accessories thereof
    23. Display manufacturing machines, and parts and accessories thereof
    24. Controllers for display manufacturing machines, and parts and accessories thereof
    25. Debonders, and parts and accessories thereof
    26. Plastic processing machines and apparatus, and parts and accessories thereof
    27. Laser processing machines for plastic processing, and parts and accessories thereof
    28. Exposure apparatus for use in display manufacturing, and parts and accessories thereof
    29. Laser processing machines for printed circuit board manufacturing, and parts and accessories thereof
    30. Processing machines for printed circuit board manufacturing, and parts and accessories thereof
    31. Bonders, and parts and accessories thereof
    32. Mass transfer equipment, and parts and accessories thereof
    33. Memory chip manufacturing machines, and parts and accessories thereof
    34. Lift equipment, and parts and accessories thereof
    35. Laser lift off equipment, and parts and accessories thereof
    36. Semiconductor manufacturing machines with laser, and parts and accessories thereof
    37. Printed circuit board manufacturing machines with laser, and parts and accessories thereof
    38. Device for marking objects with laser beam
    39. Laser welding machines
    40. Machines for debonding electronic components from boards by laser irradiating laminated components, and parts and accessories thereof
    41. Metalworking machines and tools, and parts and accessories thereof
    42. Laser processing machines for metalworking, and parts and accessories thereof
    43. Laminated semiconductor chip manufacturing machines, and parts and accessories thereof
    44. Electronic components feeding devices for use in manufacturing electronic circuit boards, and parts and accessories thereof
    45. Stamps and plates for use in manufacturing electronic components and micro computer chips
    46. Electronic components manufacturing machines, and parts and accessories thereof
    47. Semiconductor wafer processing equipment, and parts and accessories thereof
    48. Semiconductor wafer treatment equipment, and parts and accessories thereof
    49. Semiconductor chip transferring machines, and parts and accessories thereof
    50. Semiconductor substrate manufacturing machines, and parts and accessories thereof
    51. Jigs for semiconductor substrate, and parts and accessories thereof
    52. Jigs for boards of semiconductor manufacturing machines, and parts and accessories thereof
    53. Semiconductor manufacturing machines, and parts and accessories thereof
    54. Processing machines for semiconductor manufacturing, and parts and accessories thereof
    55. Laser processing machines for semiconductor manufacturing, and parts and accessories thereof
    56. Semiconductor manufacturing machines and apparatus, and parts and accessories thereof
    57. Thermal treating equipment for semiconductor manufacturing, and parts and accessories thereof
    58. Components mounting machines for semiconductor manufacturing, and parts and accessories thereof.