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EUTM file information

019304885

DTB

January 19, 2026

Trademark Summary

The trademark application DTB was filed by LINTEC KABUSHIKI KAISHA (also trading as LINTEC CORPORATION), a corporation established under the laws of Japan (the "Applicant") and TAZMO CO., LTD., a corporation established under the laws of Japan (the "Co-Applicant", and jointly with the "Applicant" referred to as the "Applicants" going forward). Application under examination.

The application was filed in English (German was selected as the second language).

Goods And Services

  • The mark was filed in class 7 with following description of goods:
    1. Semiconductor manufacturing machines
    2. Electric irradiation apparatus for use in the manufacture of semiconductors
    3. Apparatus for adhesion of protective tapes for the front surfaces of semiconductor chips and of protective tapes for the rear surfaces of semiconductor chips for use in the manufacture of semiconductors
    4. Peeling apparatus of protective tapes for the front surfaces of semiconductor chips and of protective tapes for the rear surfaces of semiconductor chips for use in the manufacture of semiconductors
    5. Apparatus for adhesion for use in the manufacture of semiconductors
    6. Bonding apparatus for use in the manufacture of semiconductors
    7. Die bonders
    8. Mounting apparatus for mounting IC chips and other electronic components onto circuit boards.
  • The mark was filed in class 17 with following description of goods:
    1. Plastic semi-worked products
    2. Adhesive or adhesive-coated plastic films and plastic sheets
    3. Adhesive tapes and self-adhesive tapes for use in the processing of semiconductors
    4. Adhesive tapes and self-adhesive tapes for use in the mounting of semiconductors
    5. Tapes for use in the peeling of tapes for semiconductor wafer processing
    6. Pressure-sensitive self-adhesive tapes and pressure-sensitive adhesive tapes for use in the manufacture of electronic parts
    7. Protective tapes for the rear surfaces of semiconductor chips.
  • The mark was filed in class 40 with following description of goods:
    1. Laminating of adhesive tapes and self-adhesive tapes
    2. Peeling of adhesive tapes and self-adhesive tapes
    3. Treatment and processing of plastc films and sheets
    4. Treatment and processing of semiconductors or wafers
    5. Resin coating processing of semiconductors or wafers
    6. Electron beam irradiation treatment for resin
    7. Rental of semiconductor manufacturing machines and apparatus.